Molex美国

CONN HDR 22POS SMD TIN

针数22
排数2
间距800 µm
公母公

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技术参数

针数22
排数2
间距800 µm
公母公
环境与封装
Height Above Board0.144" (3.66mm)
Mated Stacking Heights4.5mm, 5.5mm
Mounting TypeSurface Mount
PackageTape & Reel (TR)
其他
Base Product Number053307
Connector TypeHeader, Outer Shroud Contacts
Contact FinishTin
Contact Finish Thickness120.0µin (3.05µm)
Features-
MfrMolex
Number of Positions22
Number of Rows2
Pitch0.031" (0.80mm)
Product StatusObsolete
SeriesSlimStack 53307

技术资料