全部替代型号
查看完整报告技术参数
针数12
排数1
间距3.96 mm
公母母
| 环境与封装 | |
|---|---|
| Mounting Type | Through Hole |
| Operating Temperature | -40°C~125°C |
| Package | Bulk |
| 其他 | |
| Base Product Number | 857-012 |
| Card Thickness | 0.054" ~ 0.070" (1.37mm ~ 1.78mm) |
| Card Type | Non Specified - Single Edge |
| Color | Black |
| Contact Finish | Gold |
| Contact Finish Thickness | 10.0µin (0.25µm) |
| Contact Material | Copper Alloy |
| Contact Type | Semi Bellows |
| Features | - |
| Flange Feature | Flush Mount, Floating Bobbin, 0.116" (2.95mm) Dia |
| Gender | Female |
| Material - Insulation | Polyphenylene Sulfide (PPS) |
| Mfr | EDAC Inc. |
| Number of Positions | 12 |
| Number of Positions/Bay/Row | 12 |
| Number of Rows | 1 |
| Pitch | 0.156" (3.96mm) |
| Product Status | Active |
| Read Out | Single |
| Series | 857 |
| Termination | Solder |
| Termination Rows | 1 |