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| 环境与封装 | |
|---|---|
| Fin Height | - |
| Package | Bulk |
| Package Cooled | - |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 4.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural | - |
| 其他 | |
| Attachment Method | Adhesive |
| Base Product Number | ATS-EX1 |
| Diameter | - |
| Length | - |
| Material | - |
| Material Finish | - |
| Mfr | Advanced Thermal Solutions Inc. |
| Product Status | Active |
| Series | maxiFLOW |
| Shape | - |
| Shelf Life | - |
| Type | - |
| Width | - |
技术资料
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