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| 环境与封装 | |
|---|---|
| Package | SOP8 150mil,TSSOP8,UDFN8(2x3 mm) |
| 其他 | |
| Density | 1024Kb |
| Features | Software Write Protect,Hardware Write Protect,Unique ID,ID Page / Lock ID Page |
| Serial Interface | SPI |
| Status | MP |
| Tem. | -40℃~105℃ |
| 环境与封装 | |
|---|---|
| Package | SOP8 150mil,TSSOP8,UDFN8(2x3 mm) |
| 其他 | |
| Density | 1024Kb |
| Features | Software Write Protect,Hardware Write Protect,Unique ID,ID Page / Lock ID Page |
| Serial Interface | SPI |
| Status | MP |
| Tem. | -40℃~105℃ |