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| 环境与封装 | |
|---|---|
| High temp. exposure | 85 °C, 96 h |
| Low temp. exposure | - 40 °C, 96 h |
| Operating temp. range | - 40 ~ 85 °C |
| Storage temp. range | - 40 ~ 85 °C |
| Thermal shock | - 40 (0.5 h) ~ 85 °C (0.5 h), 5 cycles |
| 其他 | |
| Contact rating | Non-switching: 100 mA 50 VDC Switching: 100 mA 6 VDC / 25 mA 24 VDCMinimum: 1 μA 20 mVDC |
| Contact resistance | 50 mΩ maximum |
| Dielectric strength | 500 VAC, 60 s |
| Humidity | - 10 ~ 65 °C, Relative humidity 0 ~ 96 %, 24 h for 10 cycles |
| Insulation resistance | 1000 MΩ (100 VDC) minimum |
| Load life | Continuous load 2000 cycles, 100 ± 10 mA, 6 ± 0.5 VDC |
| Net weight | Approx. 0.05 g (CAS-120) Approx. 0.08 g (CAS-220 / D20) |
| Operating force | 0.5 ~ 5 N {0.05 ~ 0.51 kgf} |
| Pull-off strength | 5 N {0.51 kgf} 10 s |
| Sealing | Washable type available with seal tape |
| Shear (Adhesion) | 5 N {0.51 kgf} 10 s |
| Shock | 490 m/s2, 11 ms 6 directions for 3 times each |
| Solderability | 245 ± 3 °C, 2 ~ 3 s |
| Soldering heat | Reflow: 255 °C (Peak temperature) (Please refer to the profile below)Manual soldering: 350 ± 10 °C, 3 ~ 4 s |
| Stop strength | 10 N {1.02 kgf}, 60 s |
| Substrate bending | Width 90 mm, bend 3 mm, 5 s, 1 time |
| Vibration | Amplitude 1.5 mm or (Acceleration) 98 m/s2, 10-500 Hz, 3 directions for 10 cycles each |