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| 环境与封装 | |
|---|---|
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.00 |
| Qualification Level | QML Class V (space) |
| Temp. Range (°C) | -55 to +125°C |
| 其他 | |
| Carrier Type | Die Waffle Pack |
| DLA SMD | 5962R9572401V9A |
| Lead Compliant | No |
| MOQ | 100 |
| Pb Free Category | None |
| Pb (Lead) Free | Yes |
| Pkg. Type | DIE |
| Rating | Space |
| Tape & Reel | No |
| TID HDR (krad(Si)) | 200 |