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| 环境与封装 | |
|---|---|
| Fin Height | - |
| Package | Bag |
| Package Cooled | FPGA |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | - |
| Thermal Resistance @ Natural | - |
| 其他 | |
| Attachment Method | - |
| Base Product Number | HS-ZX |
| Diameter | - |
| Length | - |
| Material | - |
| Material Finish | - |
| Mfr | Enclustra FPGA Solutions |
| Product Status | Active |
| Series | Mars ZX2, ZX3 |
| Shape | - |
| Shelf Life | - |
| Type | Top Mount |
| Width | - |
技术资料
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