全部替代型号
查看完整报告技术参数
| 环境与封装 | |
|---|---|
| Package | Bulk |
| Package Accepted | LGA |
| Size / Dimension | 1.000" x 1.400" (25.40mm x 35.56mm) |
| 其他 | |
| Board Thickness | 0.062" (1.57mm) 1/16" |
| Material | FR4 Epoxy Glass |
| Mfr | Chip Quik Inc. |
| Number of Positions | 28 |
| Pitch | 0.024" (0.60mm) |
| Product Status | Active |
| Proto Board Type | SMD to DIP |
| Series | Proto-Advantage |
技术资料
该型号暂未收录资料。