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| 环境与封装 | |
|---|---|
| Package | Bulk |
| Package Accepted | HSOP |
| Size / Dimension | 1.000" x 2.200" (25.40mm x 55.88mm) |
| 其他 | |
| Board Thickness | 0.062" (1.57mm) 1/16" |
| Material | FR4 Epoxy Glass |
| Mfr | Chip Quik Inc. |
| Number of Positions | 44 |
| Pitch | 0.026" (0.65mm) |
| Product Status | Active |
| Proto Board Type | SMD to DIP |
| Series | Proto-Advantage |