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技术参数

环境与封装
PackageBulk
Package AcceptedSOP
Size / Dimension1.000" x 0.400" (25.40mm x 10.16mm)
其他
Board Thickness0.062" (1.57mm) 1/16"
MaterialFR4 Epoxy Glass
MfrChip Quik Inc.
Number of Positions8
Pitch0.100" (2.54mm)
Product StatusActive
Proto Board TypeSMD to DIP
SeriesProto-Advantage

技术资料