POWERPAD-16/POWERSOIC-16 TO DIP-

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技术参数

环境与封装
PackageBulk
Package AcceptedPowerSOIC
Size / Dimension1.000" L x 1.000" W (25.40mm x 25.40mm)
其他
Board Thickness0.063" (1.60mm)
MaterialFR4 Epoxy Glass
MfrChip Quik Inc.
Number of Positions16
Pitch0.050" (1.27mm)
Product StatusActive
Proto Board TypeSMD to DIP
SeriesProto-Advantage

技术资料