全部替代型号
查看完整报告技术参数
| 环境与封装 | |
|---|---|
| Inner Dimension | 0.315" L x 0.236" W (8.00mm x 6.00mm) |
| Outer Dimension | 1.300" L x 0.900" W (33.02mm x 22.86mm) |
| Package | Bulk |
| Thermal Center Pad | - |
| 其他 | |
| Material | Stainless Steel |
| Mfr | Chip Quik Inc. |
| Number of Positions | 25 |
| Pitch | 0.039" (1.00mm) |
| Product Status | Active |
| Series | Proto-Advantage IPC |
| Thickness | 0.0040" (0.102mm) |
| Type | BGA |