全部替代型号
查看完整报告技术参数
| 环境与封装 | |
|---|---|
| Package | Bulk |
| Package Accepted | BGA |
| Size / Dimension | 1.000" L x 1.300" W (25.40mm x 33.02mm) |
| 其他 | |
| Board Thickness | 0.063" (1.60mm) |
| Material | FR4 Epoxy Glass |
| Mfr | Chip Quik Inc. |
| Number of Positions | 25 |
| Pitch | 0.039" (1.00mm) |
| Product Status | Active |
| Proto Board Type | SMD to DIP |
| Series | Proto-Advantage |