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| 环境与封装 | |
|---|---|
| Package | Bulk |
| Package Accepted | HTSSOP |
| Size / Dimension | 3.000" L x 1.000" W (76.20mm x 25.40mm) |
| 其他 | |
| Board Thickness | 0.063" (1.60mm) |
| Material | FR4 Epoxy Glass |
| Mfr | Chip Quik Inc. |
| Number of Positions | 56 |
| Pitch | 0.020" (0.50mm) |
| Product Status | Active |
| Proto Board Type | SMD to DIP |
| Series | Proto-Advantage |
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