TGF25-07870787-059

在产垫,片材

THERM PAD 199.9MMX199.9MM YLW

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技术参数

环境与封装
PackageBulk
Storage/Refrigeration Temperature-
Thermal Conductivity2.5W/m-K
Thermal Resistivity1.00°C/W
其他
Adhesive-
Backing, Carrier-
ColorYellow
MaterialAluminum Oxide filled Silicone
MfrLeader Tech Inc.
Outline199.90mm x 199.90mm
Product StatusActive
SeriesTGF25
ShapeSquare
Shelf Life24 Months
Shelf Life Start-
Thickness0.0591" (1.500mm)
TypeGap Filler Pad, Sheet
Usage-

技术资料