Laird Technologies EMIUnited States
NOSG,STR,SNB,PSA
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Height | 0.130" (3.30mm) |
| Operating Temperature | 121°C |
| Package | Bulk |
| Storage/Refrigeration Temperature | - |
| Other | |
| Attachment Method | Adhesive |
| Length | 16.000" (406.40mm) |
| Material | Beryllium Copper |
| Mfr | Laird Technologies EMI |
| Plating | Tin |
| Plating - Thickness | 299.21µin (7.60µm) |
| Product Status | Active |
| Series | No Snag |
| Shape | - |
| Shelf Life | - |
| Shelf Life Start | - |
| Type | Fingerstock |
| Width | 0.370" (9.40mm) |