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Technical parameters

Environment and package
Mounting FeatureNormal, Standard - Top
Mounting TypeThrough Hole
PackageBulk
Other
Connector StyleFB-DIMM
Contact FinishGold
Contact Finish Thickness3.00µin (0.076µm)
FeaturesBoard Lock, Latches
Memory TypeDDR2 FBDRAM
MfrTE Connectivity AMP Connectors
Number of Positions240
Product StatusObsolete
Series-
StandardsMO-256

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