All alternatives
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Technical parameters
| Power | |
|---|---|
| 关断电流 | 5uA |
| 待机电流 | 5μA |
| 最大工作电压 | 5.5V |
| 最小工作电压 | 4.5V |
| 静态工作电流 | 40mA |
| 静态电流 | 40mA |
| Environment and package | |
| 封装类型1 | TSOP |
| 封装类型2 | QFJ |
| 封装类型3 | DIP |
| 封装类型4 | QFJ |
| 封装类型5 | TSOP |
| 封装类型6 | DIP |
| 尺寸规格4 | 13.97*11.43*3.56mm |
| 尺寸规格5 | 18.4*8*1.2mm |
| 尺寸规格6 | 42.04*15.24*5.72mm |
| 最大工作温度 | 70°C |
| 最小工作温度 | -40°C |
| Other | |
| 公用FLASH接口 | 0 |
| 内存数据长度 | 8bit |
| 命令用户接口 | 1 |
| 存储密度 | 2.097Mbit |
| 引脚数量1 | 32 |
| 引脚数量2 | 32 |
| 引脚数量3 | 32 |
| 引脚数量4 | 32 |
| 引脚数量5 | 32 |
| 引脚数量6 | 32 |
| 数据校验 | 1 |
| 最大存取时间 | 90ns |
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