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Technical parameters
| Power | |
|---|---|
| 关断电流 | 5uA |
| 待机电流 | 5μA |
| 最大工作电压 | 5V |
| 静态工作电流 | 60mA |
| 静态电流 | 60mA |
| Environment and package | |
| 封装类型1 | DIE |
| 封装类型2 | TSOP1 |
| 封装类型3 | TSOP1 |
| 封装类型4 | SOIC |
| 尺寸规格2 | 18.4*10*1.2mm |
| 尺寸规格3 | 18.4*12*1.2mm |
| 尺寸规格4 | 28.2*13.3*2.8mm |
| 最大工作温度 | 70°C |
| Other | |
| 公用FLASH接口 | 1 |
| 内存数据长度 | 8bit |
| 命令用户接口 | 1 |
| 存储密度 | 16.777Mbit |
| 引脚数量1 | 38 |
| 引脚数量2 | 40 |
| 引脚数量3 | 48 |
| 引脚数量4 | 44 |
| 数据校验 | 1 |
| 最大存取时间 | 120ns |
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