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Technical parameters

Power
待机电流5μA
最大工作电压2.2V
最小工作电压1.65V
静态电流30mA
Environment and package
封装类型1TSOP1
封装类型2BGA
尺寸规格118.4*12*1.2mm
尺寸规格28.15*6.15*1.2mm
最大工作温度85°C
最小工作温度-40°C
Other
公用FLASH接口0
内存数据长度16bit
命令用户接口1
存储密度8.389Mbit
引脚数量148
引脚数量248
数据校验1
最大存取时间120ns

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