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Technical parameters
Key specs
Clock frequency66 MHzMax
| Power | |
|---|---|
| 最大工作电压 | 3.6V |
| 最小工作电压 | 2.7V |
| 静态工作电流 | 10μA |
| AC and DC characteristics | |
| 最大时钟频率 | 66MHz |
| Environment and package | |
| 封装类型1 | SON |
| 封装类型2 | BGA |
| 封装类型3 | DFN |
| 封装类型4 | DFN |
| 封装类型5 | SOIC |
| 封装类型6 | TSOP1 |
| 尺寸规格1 | 8*6*1mm |
| 尺寸规格2 | 8*6*1.4mm |
| 尺寸规格3 | 6*5*1mm |
| 尺寸规格4 | 8*6*1mm |
| 尺寸规格5 | 5.29*5.24*2.16mm |
| 尺寸规格6 | 11.8*8*1.2mm |
| 最大工作温度 | 85°C |
| 最小工作温度 | -40°C |
| Other | |
| 公用FLASH接口 | 0 |
| 内存数据长度 | 1bit |
| 命令用户接口 | 0 |
| 存储密度 | 33.554Mbit |
| 引脚数量1 | 8 |
| 引脚数量2 | 24 |
| 引脚数量3 | 8 |
| 引脚数量4 | 8 |
| 引脚数量5 | 8 |
| 引脚数量6 | 28 |
| 数据校验 | 0 |
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