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Technical parameters
| Power | |
|---|---|
| 最大工作电压 | 5.5V |
| 最小工作电压 | 4.5V |
| 静态工作电流 | 300μA |
| Environment and package | |
| 封装类型1 | BGA |
| 封装类型2 | SOIC |
| 封装类型3 | TSOP |
| 尺寸规格1 | 14*8*1.4mm |
| 尺寸规格2 | 28.2*13.34*2.77mm |
| 尺寸规格3 | 18.4*10*1.2mm |
| 最大工作温度 | 85°C |
| 最小工作温度 | -40°C |
| Other | |
| 公用FLASH接口 | 0 |
| 内存数据长度 | 8bit |
| 命令用户接口 | 1 |
| 存储密度 | 8.389Mbit |
| 引脚数量1 | 42 |
| 引脚数量2 | 44 |
| 引脚数量3 | 40 |
| 数据校验 | 1 |
| 最大存取时间 | 90ns |
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