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Technical parameters

Environment and package
Fin Height-
PackageBulk
Package Cooled-
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow4.00°C/W @ 200 LFM
Thermal Resistance @ Natural-
Other
Attachment MethodAdhesive
Base Product NumberATS-EX1
Diameter-
Length-
Material-
Material Finish-
MfrAdvanced Thermal Solutions Inc.
Product StatusActive
SeriesmaxiFLOW
Shape-
Shelf Life-
Type-
Width-

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