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Technical parameters

Environment and package
Operating temperature range- 40 ~ + 85 ℃
Storage temperature range- 40 ~ + 85 ℃
Other
Dielectric strength250 VAC 1 minute
Electrical life10,000 operations at max. rating30,000 operations at min. rating
Flux CleaningSolvents: Fluorine or Alcohol type Cleaning after soldering should be done after the PC board is exposed to room temperature (30 ℃ or below) for 1 to 2 hours. Do not use ultrasonic cleaning.
Initial contact resistance100 m Ω max. (200 μVAC 1.5 mA)
Insulation resistance500 MΩ min. (250 VDC)
Mechanical life30,000 cycles
Operating force47 ± 0.98 N
Rating0.4 VA (28 VDC max.)1 μA 20 mVDC
Soldering SpecificationsManual Soldering / Device:Soldering iron 350 ℃ Max. 3 sec. Max. Auto Soldering/Device:Jet wave type or dip type 260 ℃ Max.3-5sec.(One time)Total dip time within 10 sec. Pre-heating should be done at temperatures from 80 °C to 120 °C and within 120 seconds When soldering two or more terminals to a common land, use solder resist to separate them

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