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Technical parameters

Environment and package
High temp. exposure85 ℃, 96 h
Low temp. exposure- 40 ℃, 96 h
Operating temp. range40 ~ 85 ℃
Storage temp. range40 ~ 85 ℃
Thermal shock- 40 (0.5 h) ~ 85 ℃ (0.5 h), 5 cycles
Other
Humidity- 10 ~ 65 ℃, Relative humidity 0 ~ 96 %, 24 h for 10 cycles
Load lifeContinuous load 1000 cycles, 6 ± 0.5 VDC, 100 ± 10 mA
Net weightApprox. 0.55 g (CFP-02) Approx. 0.86 g (CFP-04) Approx. 1.19 g (CFP-06) Approx. 1.90 g (CFP-10) Approx. 0.70 g (CFP-03) Approx. 1.03 g (CFP-05) Approx. 1.54 g (CFP-08)
Operation angle21°
Operation force7 N {0.71 kgf} maximum
Pull-off strength5 N {0.51 kgf} 10 s
SealingNon-washable
Shear (Adhesion)5N {0.51 kgf} 10s
Shock490 m/s², 11ms 6directions for 3times each
Solderability245 ± 3 °C, 2 ~ 3 s
Soldering heatFlow: 260 ± 3 °C, 5 ~ 6 s, two times maximumReflow: 255 °C (Peak temperature)Manual soldering: 350 ± 10 °C, 3 ~ 4 s
Stop strength10 N {1.02 kgf} 60 s
Substrate bendingWidth 90 mm, bend 3 mm, 5 s, 1 time
VibrationAmplitude 1.5 mm or Acceleration 98 m/s2, 10-500 Hz, 3 directions for 10 cycles each

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