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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Operating temp. range | - 40 ~ 85 °C |
| Storage temp. range | - 40 ~ 85 °C |
| Other | |
| Contact rating | Non-switching: 100 mA 50 VDCSwitching: 100 mA 12 VDCMinimum: 1 μA 20 mVDC |
| Contact resistance | 70 mΩ maximum |
| Contact timing | Non-shorting |
| Dielectric strength | 500 VAC, 60 s |
| Insulation resistance | 100 MΩ minimum (500 VDC) |
| Net weight | 0.40 g (CMS-2202) 0.42 g (CMS-2214)0.45 g (CMS-2302) 0.48 g (CMS-2314)0.50 g (CMS-2402) 0.54 g (CMS-2414)0.42 g (CMS-2212) 0.80 g (CMS-4202)0.48 g (CMS-2312) 0.84 g (CMS-4216)0.54 g (CMS-2412) |
| No. of positions | 2, 3, 4 |
| Operating force | 1.5 ± 1 N {0.15 ± 0.1 kgf} |
| Pull-off strength | 50 N {5.09 kgf} 10 s |
| Sealing | Non- Washable |
| Shear (Adhesion) | 50 N {5.09 kgf} 10 s |
| Solderability | 245 ± 3 °C, 2 ~ 3 s |
| Soldering heat | Flow: 260 ± 3 °C, 5 ~ 6 sReflow: 255 °C (Peak temperature) ※Please refer to the profile belowManual soldering: 350 ± 10 °C, 3 ~ 4 s |
| Stop strength | 30 N {3.06 kgf} 15 s (Top setting)10 N {1.02 kgf} 15 s (Side setting) |
| Stroke | 2 mm |
| Substrate bending | Width 90 mm, bend 3 mm, 5 s, 1 time |