All alternatives

View full report

Technical parameters

Environment and package
PackageBulk
Package AcceptedLGA
Size / Dimension1.000" x 0.500" (25.40mm x 12.70mm)
Other
Board Thickness0.062" (1.57mm) 1/16"
MaterialFR4 Epoxy Glass
MfrChip Quik Inc.
Number of Positions10
Pitch-
Product StatusActive
Proto Board TypeSMD to DIP
SeriesProto-Advantage

Documents