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Technical parameters

Environment and package
PackageBulk
Package AcceptedHSOP
Size / Dimension1.200" x 2.400" (30.48mm x 60.96mm)
Other
Board Thickness0.062" (1.57mm) 1/16"
MaterialFR4 Epoxy Glass
MfrChip Quik Inc.
Number of Positions44
Pitch0.026" (0.65mm)
Product StatusActive
Proto Board TypeSMD to DIP
SeriesProto-Advantage

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