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Technical parameters

Environment and package
Inner Dimension0.407" L x 0.295" W (10.35mm x 7.50mm)
Outer Dimension1.300" L x 0.900" W (33.02mm x 22.86mm)
PackageBulk
Thermal Center Pad0.217" L x 0.185" W (5.50mm x 4.70mm)
Other
MaterialStainless Steel
MfrChip Quik Inc.
Number of Positions36
Pitch0.020" (0.50mm)
Product StatusActive
SeriesProto-Advantage IPC
Thickness0.0040" (0.102mm)
TypePowerSSO

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