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Technical parameters

Environment and package
PackageBulk
Package AcceptedHSOP
Size / Dimension1.000" x 2.600" (25.40mm x 66.04mm)
Other
Board Thickness0.062" (1.57mm) 1/16"
MaterialFR4 Epoxy Glass
MfrChip Quik Inc.
Number of Positions48
Pitch0.026" (0.65mm)
Product StatusActive
Proto Board TypeSMD to DIP
SeriesProto-Advantage

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