All alternatives

View full report

Technical parameters

Environment and package
Inner Dimension0.512" L x 0.236" W (13.00mm x 6.00mm)
Outer Dimension1.300" L x 0.900" W (33.02mm x 22.86mm)
PackageBulk
Thermal Center Pad-
Other
MaterialStainless Steel
MfrChip Quik Inc.
Number of Positions24
Pitch0.039" (1.00mm)
Product StatusActive
SeriesProto-Advantage IPC
Thickness0.0040" (0.102mm)
TypeSSOP

Documents

No documents are linked to this part yet.