Chip Quik Inc.United States
POWERPAD-16/POWERSOIC-16 TO DIP-
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Package Accepted | PowerSOIC |
| Size / Dimension | 1.000" L x 1.000" W (25.40mm x 25.40mm) |
| Other | |
| Board Thickness | 0.063" (1.60mm) |
| Material | FR4 Epoxy Glass |
| Mfr | Chip Quik Inc. |
| Number of Positions | 16 |
| Pitch | 0.050" (1.27mm) |
| Product Status | Active |
| Proto Board Type | SMD to DIP |
| Series | Proto-Advantage |