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Technical parameters

Environment and package
Inner Dimension1.106" L x 0.520" W (28.10mm x 13.20mm)
Outer Dimension1.300" L x 0.900" W (33.02mm x 22.86mm)
PackageBulk
Thermal Center Pad-
Other
MaterialStainless Steel
MfrChip Quik Inc.
Number of Positions44
Pitch0.050" (1.27mm)
Product StatusActive
SeriesProto-Advantage IPC
Thickness0.0040" (0.102mm)
TypeSOIC

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