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Technical parameters

Environment and package
Inner Dimension0.157" L x 0.138" W (4.00mm x 3.50mm)
Outer Dimension1.300" L x 0.900" W (33.02mm x 22.86mm)
PackageBulk
Thermal Center Pad0.100" L x 0.081" W (2.55mm x 2.05mm)
Other
MaterialStainless Steel
MfrChip Quik Inc.
Number of Positions20
Pitch0.020" (0.50mm)
Product StatusActive
SeriesProto-Advantage IPC
Thickness0.0040" (0.102mm)
TypeQFN/LFCSP

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