Chip Quik Inc.United States
POWERPAD-28/POWERSOIC-28 TO DIP-
All alternatives
View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Package Accepted | PowerSOIC |
| Size / Dimension | 1.000" L x 1.600" W (25.40mm x 40.64mm) |
| Other | |
| Board Thickness | 0.063" (1.60mm) |
| Material | FR4 Epoxy Glass |
| Mfr | Chip Quik Inc. |
| Number of Positions | 28 |
| Pitch | 0.050" (1.27mm) |
| Product Status | Active |
| Proto Board Type | SMD to DIP |
| Series | Proto-Advantage |