Chip Quik Inc.United States
BGA-8 (0.5 MM PITCH 2 X 1 MM BOD
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Inner Dimension | 0.079" L x 0.039" W (2.00mm x 1.00mm) |
| Outer Dimension | 1.300" L x 0.900" W (33.02mm x 22.86mm) |
| Package | Bulk |
| Thermal Center Pad | - |
| Other | |
| Material | Stainless Steel |
| Mfr | Chip Quik Inc. |
| Number of Positions | 8 |
| Pitch | 0.020" (0.50mm) |
| Product Status | Active |
| Series | Proto-Advantage IPC |
| Thickness | 0.0040" (0.102mm) |
| Type | BGA |
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