All alternatives

View full report

Technical parameters

Environment and package
PackageBulk
Package AcceptedHTQFP
Size / Dimension3.400" L x 1.000" W (86.36mm x 25.40mm)
Other
Board Thickness0.063" (1.60mm)
MaterialFR4 Epoxy Glass
MfrChip Quik Inc.
Number of Positions64
Pitch0.031" (0.80mm)
Product StatusActive
Proto Board TypeSMD to DIP
SeriesProto-Advantage

Documents

No documents are linked to this part yet.