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View full reportTechnical parameters
| Power | |
|---|---|
| Leakage current (min)[uA] | 83.0 |
| Environment and package | |
| Dimension L | 10 ±0.5 |
| Dimension φD | φ8 ±0.5 |
| Endurance 2 [hr](Temp.[℃]) | 4000 (125) |
| Endurance[hr] (Temp.[℃]) | 4000 (135) |
| Rated Ripple(max)2 [mArms] (Temp.[℃]/Freq.[Hz]) | 3900<br>(125/100k) |
| Rated Ripple(max)[mArms] (Temp.[℃]/Freq.[Hz]) | 2900<br>(135/100k) |
| RoHS | RoHS compliance |
| Size (φDxL) | φ8x10 |
| Temp Lower[℃] | -55 |
| Temp Upper[℃] | 135 |
| Other | |
| Capacitance | 330 uF |
| Cap. Tole. | ± 20 % |
| ESR (max)[Ω] | 0.019 |
| ModifiedDate | 1782777600 |
| Part Number | RAHTX331M1TEH0002K |
| Previous Part Number | HTX-25V331MG10KQ-R2 |
| Q200 | Q200 |
| Rated Volt. [Vdc] | 25.0 |
| Rec Apps. | SR6-AE@AP1, SR6-AE@AP2 |
| Shape | Vertical Chip<br>for Vibration (SMD) |
| Standard Quantity | 500 |
| Status | MP |
| tanδ (max) | 0.14 |
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