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Technical parameters

Power
Channels (#)1
Channels per device (#)1
Environment and package
Moisture Sensitivity Level (MSL)1
Mounting TypeSurface Mount
Qualification LevelIndustrial
Other
ApplicationIndustrial, Consumer Use
Carrier TypeEmbossed Tape
Ciss (Typical) (pF)3270
Country of AssemblyMalaysia
Country of Wafer FabricationJapan
ID (A)40
Lead CompliantYes
Lead Count (#)8
MOQ3000
Nch/PchNch
Pb (Lead) FreeYes
Pch (W)40
Pkg. TypeWPAK(3F)
Qg typ (nC)21
RDS (ON) (Max) @10V (mohm)4.3
RDS (ON) (Max) @4.5V (mohm)5.9
RDS (ON) (Typical) @ 10V / 8V (mohm)3.3
Simulation Model AvailableYes
Standard Pkg. TypePower SON-8 5x6
Tape & ReelNo
Thickness (mm)0.85
VDSS (Max) (V)30
Vgs (off) (Max) (V)2.5
VGSS (V)20

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