Chip Quik Inc.United States
ALUMINUM SOLDER PASTE WATER-SOLU
All alternatives
View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Storage/Refrigeration Temperature | 37°F~46°F(3°C~8°C) |
| Other | |
| Composition | Sn96.5Ag3.5 (96.5/3.5) |
| Diameter | - |
| Digi-Key Storage | Refrigerated |
| Flux Type | Water Soluble |
| Form | Syringe, 0.35 oz (10g), 5cc |
| Melting Point | 430°F (221°C) |
| Mesh Type | 3 |
| Mfr | Chip Quik Inc. |
| Process | Lead Free |
| Product Status | Active |
| Series | SMD |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
| Type | Solder Paste |
| Wire Gauge | - |
Documents
No documents are linked to this part yet.