MolexUnited States
CONN RCPT 8POS 0.118 GOLD PCB
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View full reportTechnical parameters
Key specs
Positions8
Rows2
Pitch3 mm
GenderFemale
Current rating5 AMax
| Power | |
|---|---|
| Current Rating (Amps) | 5A |
| Voltage Rating | 250VAC |
| Environment and package | |
| Insulation Height | 0.535" (13.60mm) |
| Mated Stacking Heights | 16.86mm |
| Mounting Type | Through Hole |
| Operating Temperature | -40°C ~ 105°C |
| Package | Tray |
| Other | |
| Applications | General Purpose, Telecommunications |
| Base Product Number | 044769 |
| Connector Type | Receptacle |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 15.0µin (0.38µm) |
| Contact Finish Thickness - Post | 100.0µin (2.54µm) |
| Contact Length - Post | 0.134" (3.40mm) |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Female Socket |
| Fastening Type | Push-Pull |
| Features | Blind Mating, Board Guide |
| Ingress Protection | - |
| Insulation Color | Black |
| Insulation Material | Liquid Crystal Polymer (LCP), Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mfr | Molex |
| Number of Positions | 8 |
| Number of Positions Loaded | All |
| Number of Rows | 2 |
| Pitch - Mating | 0.118" (3.00mm) |
| Product Status | Active |
| Row Spacing - Mating | 0.118" (3.00mm) |
| Series | Micro-Fit 3.0 BMI 44769 |
| Style | Board to Board or Cable |
| Termination | Solder |