Laird Technologies EMIUnited States
RFI EMI GROUNDING MATERIAL 25FT
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Height | 0.110" (2.79mm) |
| Operating Temperature | 121°C |
| Package | Bulk |
| Storage/Refrigeration Temperature | - |
| Other | |
| Attachment Method | Adhesive |
| Length | 16.000" (406.40mm) |
| Material | Beryllium Copper |
| Mfr | Laird Technologies EMI |
| Plating | Unplated |
| Plating - Thickness | - |
| Product Status | Active |
| Series | All-Purpose |
| Shape | - |
| Shelf Life | - |
| Shelf Life Start | - |
| Type | Fingerstock |
| Width | 0.280" (7.11mm) |