27MMP008

在产电路板支撑件

PCB SUPPORT, LOCKING, .098/.098

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技术参数

环境与封装
Between Board Height0.315" (8.00mm)
Mounting Hole Diameter0.098" (2.50mm)
Mounting Panel Thickness0.062" (1.57mm) 1/16"
Mounting TypeSnap Lock
PackageBulk
其他
Base Product Number27MMP
Features-
Holding TypeSnap Lock
Length - Overall0.595" (15.12mm)
MaterialNylon
MfrEssentra Components
Product StatusActive
SeriesMMP
Support Hole Diameter0.098" (2.50mm)
Support Panel Thickness0.062" (1.57mm) 1/16"

技术资料

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