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Technical parameters

Environment and package
Flash Size-
Operating Temperature-40°C ~ 125°C (TJ)
PackageTray
Package / Case896-BGA
RAM Size64KB
Supplier Device Package896-FBGA (31x31)
Other
ArchitectureMCU, FPGA
Base Product Number5CSEMA6
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
MfrIntel
Number of I/OMCU - 181, FPGA - 288
PeripheralsDMA, POR, WDT
Primary AttributesFPGA - 110K Logic Elements
Product StatusActive
SeriesAutomotive, AEC-Q100, Cyclone® V SE
Speed700MHz

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