Samtec Inc.United States

ASP-137969-01

ActiveArrays, Edge Type, Mezzanine (Board to Board)PARTS TO BE PACKAGED IN TRAYS

CONN SOCKET 22POS SMD GOLD

Samtec ASP-137969-01 is a modified ERF8 board-to-board connector assembly featuring a black Vectra E130i housing and beryllium copper contacts with gold plating on contact areas and a minimum pushout force of 2.22N.Checked against the datasheet

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Technical parameters

Key specs

Positions22
Rows2
Pitch800 µm
GenderFemale

Datasheet-verified parameters

8 items
ParameterValue and test conditionsSource
Housing MaterialVECTRA E130i, COLOR: BLACK
Contact MaterialBeCu, 390 HT
Contact Area Plating.000030 GOLD OVER .000050 NICKEL
Remainder Plating.000200 REF TIN OVER .000050 NICKEL
Latches Plating.000003 GOLD OVER .000050 NICKEL
Minimum Pushout Force2.22N [.5LB]
Maximum Burr Allowance.038 [.0015]
PackagingPARTS TO BE PACKAGED IN TRAYS
All parameters (15)ExpandCollapse
Environment and package
Height Above Board0.215" (5.46mm)
Mated Stacking Heights-
Mounting TypeSurface Mount
PackageTray
Other
Base Product Number137969-01
Connector TypeSocket, Center Strip Contacts
Contact FinishGold
Contact Finish Thickness30.0µin (0.76µm)
FeaturesVITA 57
MfrSamtec Inc.
Number of Positions22
Number of Rows2
Pitch0.031" (0.80mm)
Product StatusActive
SeriesASP

Documents

DatasheetDatasheet · 229.4 KB · 2026-11-02
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Datasheet-verified content is extracted by AI from the manufacturer datasheet. Click a page number to view the original.