Chip Quik Inc.United States
STENCIL BGA-100 1MM
All alternatives
View full reportTechnical parameters
| Environment and package | |
|---|---|
| Inner Dimension | - |
| Outer Dimension | 1.300" L x 0.900" W (33.02mm x 22.86mm) |
| Package | Bulk |
| Thermal Center Pad | - |
| Other | |
| Material | Stainless Steel |
| Mfr | Chip Quik Inc. |
| Number of Positions | 100 |
| Pitch | 0.039" (1.00mm) |
| Product Status | Active |
| Series | Proto-Advantage BGA |
| Thickness | 0.0040" (0.102mm) |
| Type | BGA |