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Technical parameters

Environment and package
PackageBulk
Package AcceptedBGA
Size / Dimension0.700" L x 1.800" W (17.78mm x 45.72mm)
Other
Board Thickness0.063" (1.60mm)
MaterialFR4 Epoxy Glass
MfrChip Quik Inc.
Number of Positions36
Pitch0.020" (0.50mm)
Product StatusActive
Proto Board TypeSMD to DIP
SeriesProto-Advantage

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