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Technical parameters

Environment and package
PackageBulk
Package AcceptedBGA
Size / Dimension2.100" L x 2.000" W (53.34mm x 50.80mm)
Other
Board Thickness0.063" (1.60mm)
MaterialFR4 Epoxy Glass
MfrChip Quik Inc.
Number of Positions144
Pitch0.020" (0.50mm)
Product StatusActive
Proto Board TypeSMD to Plated Through Hole Board
SeriesProto-Advantage

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