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Technical parameters

Environment and package
PackageBulk
Package AcceptedBGA
Size / Dimension4.400" L x 3.500" W (111.76mm x 88.90mm)
Other
Board Thickness0.063" (1.60mm)
MaterialFR4 Epoxy Glass
MfrChip Quik Inc.
Pitch0.039" (1.00mm)
Product StatusActive
Proto Board TypeSMD to Plated Through Hole Board
SeriesProto-Advantage

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