CBDLS660A

在产电路板支撑件

PCB SPRT,TOP HL:LOCK ARROW .137

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技术参数

环境与封装
Between Board Height0.709" (18.00mm)
Mounting Hole Diameter0.137" (3.48mm)
Mounting Panel Thickness0.031" ~ 0.078" (0.79mm ~ 1.98mm)
Mounting TypeSnap Lock
PackageBag
其他
Features-
Holding TypeSnap Lock
Length - Overall-
MaterialNylon
MfrEssentra Components
Product StatusActive
SeriesRichco, CBDLS
Support Hole Diameter0.137" (3.48mm)
Support Panel Thickness0.031" ~ 0.078" (0.79mm ~ 1.98mm)

技术资料

该型号暂未收录资料。